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Old 2020-09-16, 17:35   #1
Uncwilly
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Default Is the end of thermal paste in sight for HPC?

I heard an interview with the founder of this company. Sounds like a good product and that company is prepared to start delivering product to the HPC industry. Carbon nanotubes aligned and connected to an aluminum foil substrate.

https://carbice.com/
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Old 2020-09-16, 18:22   #2
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Carb ice is a scary thing to piston pilots.
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Old 2020-09-16, 18:32   #3
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Probably not, the website looks like typical marketing nonsense and thermal pads instead of paste have existed for a long time. Slightly worse thermally as they have to be thicker than a proper paste application, more expensive so consumers rarely buy them, but supposedly more reliable at getting decent contact with uneven surfaces and easy to install so some manufacturers use them. Uneven MCM chips at the very least involving multiple stacks of HBM may be a thing depending on how they're manufactured so thermal pads may see some use in HPC.


Unless I'm misreading their website and they actually have a good product, in which case they probably shouldn't have employed a marketer to hide it so well.
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Old 2020-09-16, 18:45   #4
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Listen to the interview with the founder here:
https://theorbitalmechanics.com/show...baratunde-cola

They have been working on the space application market as a starter and have been looking toward HPC and the general market eventually.
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Old 2020-09-17, 00:02   #5
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Sounds a bit like this stuff:

https://www.digikey.ca/en/product-hi...raphite-sheets

Except it wasn't really meant for CPU cooling so did not turn out so well:


Last fiddled with by ATH on 2020-09-17 at 00:03
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